{
  "sector": "Semiconductors",
  "relationships": [
    {"source": "NVDA", "target": "AMD", "type": "competitor", "strength": "high", "domain": "GPU, AI Accelerators"},
    {"source": "INTC", "target": "AMD", "type": "competitor", "strength": "high", "domain": "CPU, Data Center"},
    {"source": "TSM", "target": "INTC", "type": "competitor", "strength": "medium", "domain": "Foundry Services (Intel Foundry Services)"},
    {"source": "NVDA", "target": "TSM", "type": "supplier", "strength": "critical", "detail": "Sole source for advanced packaging (CoWoS)"},
    {"source": "AMD", "target": "TSM", "type": "supplier", "strength": "critical", "detail": "7nm/5nm fabrication"},
    {"source": "ASML", "target": "TSM", "type": "supplier", "strength": "critical", "detail": "EUV Lithography Machines"}
  ]
}